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By S M Sohel Murshed

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8th World Conf. Experi‐ ment. Heat Transfer Fluid Mechanics Thermodynamics (ExHFT-8). 2013; UFD 6 pages. , Shinmoto Y. and Ohta H. Heat transfer in boiling of immiscible mixtures. Interfac. Pheno. Heat Transfer. 2015; 3(1): 19-39. 5772/62328 Abstract The heat pipe is a well-known cooling module for advanced electronic devices. The heat pipe has many applications, particularly in electronics and related area such as PC, laptop, display, artificial satellite, and telecommunication modules. The heat pipe utilizes phase change heat transfer inside enveloped structures, where the working fluid evaporates in heated zone, and vapor moves to the condenser, and the condensed liquid is pumped back through microporous structure call wick.

However, with the smaller CPU size and increased power as encountered in modern computers, the heat flux at the CPU has been significantly increased [8]. At the same time, restrictions have been imposed on the size of heat sinks and fans and on the noise level associated with the increased fan speed. 5772/62279 that suit the modern CPU requirements. As alternatives to the conventional heat sinks, twophase cooling devices, such as heat pipe and thermosyphon, have emerged as promising heat transfer devices with effective thermal conductivity over 200 times higher than that of copper [9].

Boiling limit is also important in high operation temperature. However, a definite model for the boiling limit is still not available. The heat pipe design starts with working fluid selection, followed by wick type and container materi‐ al selections, determining diameter and thickness, wick design, and heat sink–source inter‐ face design. The application of heat pipe to electronics cooling can be classified by the configuration: heat pipe–embedded spreader, block-to-block, block-to-fin, and fin-to-fin ap‐ plications.

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