By Philip Garrou, Christopher Bower, Peter Ramm
The 1st encompassing treatise of this new and intensely very important box places the identified actual barriers for traditional 2nd microelectronics
into standpoint with the necessities for extra microelectronics advancements and marketplace prerequisites. This two-volume handbook
offers 3D ideas to the function density challenge, addressing all vital concerns, resembling wafer processing, die bonding, packaging
expertise, and thermal facets. It starts off with an introductory half, which defines priceless objectives, present concerns and relates 3D integration
to the semiconductor roadmap of the undefined. earlier than happening to hide processing know-how and 3D constitution fabrication recommendations in
aspect. this is often by way of fields of program and a glance on the way forward for 3D integration.
The editors have assembled contributions from key educational and commercial avid gamers within the box, together with Intel, Micron, IBM, Infineon,
Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI and so on
Read or Download Handbook of 3D Integration: Volumes 1 and 2 - Technology and Applications of 3D Integrated Circuits PDF
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Additional resources for Handbook of 3D Integration: Volumes 1 and 2 - Technology and Applications of 3D Integrated Circuits
5D graphics processor modules and 3D application processors with baseband and/or memory should be coming soon. 10 TSV chip wafer forecast 2010–2017. Courtesy of Yole Developpement. 11 Global TSV chip end applications in 2017. Courtesy of Yole Developpement. 11. 3D IC volume is expected to increase to nearly 10 MM wafers over the next 4 years with major increases in stacked memory, wide I/O DRAM, and logic plus memory system-in-packages (SiPs). 5/3D device product insertion, we see that most of these devices will eventually be incorporated in the smartphone and tablet markets.
To further reduce costs, many companies are considering alternatives to silicon interposers, such as glass interposers. 5D interposers is system partitioning and ability to integrate at least one logic IC with one or several memory ICs and even mixed signal or analog ICs. It involves “four slices” instead of a single-die 3D SoC repartitioned logic design. This increases CMOS manufacturing yield because of the smaller die size and high-density wiring at the surface of the four-layer copper damascene silicon interposer wafer – leading to a breakthrough in cost versus power consumption versus performance.
Such technologies will all revolve around through-silicon via (TSV) technology. 5D interposers or full 3D IC stacked chip sets is currently acting as a barrier to their introduction into today’s proposed products. 5D/3D products contain memory, either stacked or in conjunction with another function. As of late 2013, the memory stacks and/ or the silicon interposers remain too expensive for incorporation into low-cost products. 5D and 3D ICs . 5D/3D IC product launches . 5D Wide IO DRAM, HMC Cost and TSI design Cost, DRAM stack availability No consensus on mainstream (versus DDR4) yet, cost Cost/design/thermal issues, DRAM availability interposer supplier in the summer of 2013) will help drive down prices, which up to now have been controlled by the foundries.